Circuit Board Fabrication
- Layers: 1-40
- Minimum Trace Width/Spacing: 3/3 mils
- Minimum Pad Size: 3 mils
- Minimum Aspect Ratio: 12:1
- Board Thickness: 20-250 mils
- Minimum Core Thickness:
- 2 mils (without copper)
- 5 mils (with copper)
- Maximum Panel Size:
- 22” x 26” (Double-sided)
- 18” x 24” (Multi-layer)
- Materials:
- FR-4 (Regular or High TG, UL Approved)
- Polyimide
- Halogen-free
- High Frequency
- Rogers
- Taconic
- Arlon
- Nelco
- Metal Core
- MEGTRON6 (Panasonic)
- More available upon customer request
- Surface Treatments:
- HASL (Hot-Air Solder Leveling: lead or lead-free)
- ENIG (Electroless Nickel Immersion Gold)
- ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
- Immersion Silver
- Immersion Tin
- Flash Gold
- Gold Finger Plating
- OSP (Organic Surface Protection).
- More available upon customer request
- Smallest Drill Size:
- 6 mils (Mehanical)
- 3 mils (Laser)
- Smallest Finished Hole Size:
- 4 mils (Mechanical)
- 2 mils (Laser)
- Impedance Tolerance: 5%
- Minimum Solder Mask Between Pads: 2.5 mils
- Differential Impedance
- Vias:
- Blind
- Buried
- Filled
- In Pad
- Plated Edges
- Plated Edge Holes
- High Copper Weight
- Solder Mask Registration
- Scoring:
- V-Score
- Jump Score
- Countersink
- Counterbore
- Beveling
- Milling
