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Tolerance: |
Standard
|
Advanced
|
Minimum
Outer Line Width
|
.005"
|
.003"
|
Minimum
Inner Line Width
|
.005"
|
.003"
|
Minimum
Outer Space, Trace / Trace
|
.005"
|
.003"
|
Minimum
Inner Space, Trace / Trace
|
.005"
|
.003"
|
Minimum
Outer Space, Trace / Pad
|
.005"
|
.003"
|
Minimum
Inner Space, Trace / Pad
|
.005"
|
.003"
|
Minimum
Space, PCB Edge to Conductor
|
.008"
|
.005"
|
Lay-to-Layer
Registration
|
+/-
.005"
|
+/-
.003"
|
Maximum
Finished PCB Thickness
|
.250"
|
.250"
|
Minimum
Board Thickness Tolerance
|
+/-
10%
|
+/-
5%
|
Dimensions
- Hole Location
|
+/-
.001"
|
+/-
.001"
|
Dimensions
- Fab O. D.
|
+/-
.010"
|
+/-
.005"
|
Warpage
(flatness of finished board)
|
0.75%
|
0.50%
|
Minimum
Component Pitch
|
.010"
|
.008"
|
Minimum
Dielectric Thickness
|
.004"
|
.003"
|
Maximum
Number of Layers
|
20
|
24
|
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|
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|
| Pad
to Hole: |
Standard
|
Advanced
|
Minimum
Plated Hole Size
|
.010"
|
.006"
|
Tolerance
- Plated Hole Size
|
+/-
.003"
|
+
.002"-.001"
|
Nominal
Finished Hole Size
|
.012"
|
.004"
|
Minimum
Outer Non-Plated Hole to Trace Spacing
|
.008"
|
.004"
|
Minimum
Inner Non-Plated Hole to Trace Spacing
|
.010"
|
.005"
|
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|
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|
| Drilling:
|
Standard
|
Advanced
|
Minimum
Drill Size
|
.012"
|
.006"
|
Maximum
Drille Hole Size (Above .257"is routed)
|
.257"
|
.257"
|
Minimum
Aspect Ratio
|
8
|
15
|
| |
|
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|
| Testing
Capabilities: |
Standard
|
Advanced
|
Minimum
Component Pitch
|
.010"
|
.008"
|
Volts
|
100 Volts
|
250 Volts
|
Current
|
50mA
|
50mA
|
Resistance - Low
|
100 ohms
|
100 ohms
|
Resistance - High
|
10 ohms
|
10 ohms
|
|
|
|
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|
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|
| Soldermask
Criteria: |
Standard
|
Advanced
|
SMT
Minimum Pad Spacing
|
.007"
|
.003"
|
Minimum
Soldermask Dam
|
.006"
|
.004"
|
| |
|
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| Materials
Available: |
TG C
|
DK
|
FR4-04;
Standard Multifunctional
|
150°
|
4.25
- 4.60
|
FR4-06;
High Performance Epoxy Laminated
|
170°
|
4.29
- 4.60
|
FR4-08;
High Performance, High Speed, High Tg
|
180°
|
3.7
- 3.8
|
GETEX
|
175-185°
|
3.8
- 4.2
|
Polyimide
|
230-260°
|
4.2
- 4.6
|
ISOLA 370HR
|
180°
|
3.94
- 4.04
|
BT Epoxy
|
185°
|
3.6
- 4.1
|
Cyanate
Ester
|
250°
|
2.8
- 3.2
|
Teflon,
Rogers, Arlon; High Frequency Laminate
|
Call
for latest specs.
|
Call
for latest specs
|
| |
|
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| Surface
Finishes Available: |
Standard
|
Advanced
|
HASL
|
HASL - Lead Free
|
Immersion
Gold
|
OSP
|
Electroless
Nickel
|
Immersion Silver
|
Immersion Tin
|
| |
|
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| Electrical
Characteristics: |
Standard
|
Advanced
|
Impedance
Tolerance
Note: Minimum Tolerance +/- 5 ohms
|
+/-
10%
|
+/-
7%
|
Etch
Factor: These are presented as a function of the copper weight,
applying to all 3 categories:
|
|
|
Oz.
Wt. Of Copper
|
Etch
Allowance
|
|
Inner
Layer
|
2
oz.
1 oz.
½ oz.
|
.002"
.001"
.0005"
|
Per
side
Per side
Per side
|
Outer
Layer
|
2
oz.
1 oz.
½ oz.
|
.002"
.001"
.0005"
|
Per
side
Per side
Per side
|
| |
|
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